Heraeus Noblelight invented microwave-powered UV curing system technology. Compared to arc lamp curing technology, it offers significant improvements in production speeds, process consistency, operating lifetimes, and reduced heat onto the substrate. Heraeus Noblelight’s easy-to-service modular design provides process flexibility with lower cost of ownership.

The Hoya EXECURE 4000-D is a premium UV filter designed to provide exceptional clarity and protection for your camera lens. Its advanced multi-coating technology minimizes reflection and flare while maintaining high light transmission, resulting in sharp and vibrant images. With its scratch-resistant surface and water-repellent coating, the Hoya EXECURE 4000-D is the perfect choice for professional photographers and enthusiasts alike who demand the best performance from their equipment.

The Hoya UL750 is a high-performance UV filter that delivers unparalleled optical quality and protection for your camera lens. Its advanced coating technology minimizes reflections and glare while maintaining maximum light transmission, resulting in sharp and vivid images. Built with a durable and scratch-resistant surface, the Hoya UL750 is the ideal choice for professional photographers and videographers who demand the best performance and reliability from their equipment.

Keeping items and available space structured and organized minimizes search times and streamlines even the most complex work processes.

To achieve this, Kardex designed a wide range of special storage & transport boxes to meet every customer need. 

The Kardex Miniload-in-a-Box* is part of the product family Vertical Buffer Module (VBM) and provides solutions for fast-growing product ranges with limited storage space. The system uses a lightweight mini-load crane with a telescopic gripper to individually transport bins or trays to the access opening point.

A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum offset and home run features. Upgraded cutter motors and drive geometry give over 8000 max RPM at the spindle.

The NorCom 2020 provides automated in line, full matrix leak testing of hermetically sealed microelectronic and optoelectronic devices. It eliminates the need for helium mass spectroscopy and gross leak bubble testing by utilizing a patented laser interferometer to simultaneously measure gross and fine leaks in hermetic devices.

Since the reliability of hermetic electronic packages is dependent on the detection of gross and fine leaks, the NorCom 2020’s pinpoint accuracy, repeatability and increased production throughput make the system an essential requirement for hermetic device production.

Key Features

• High Throughput
• Automatic In-line Leak Detection
• Clean and Safe Procedure

The NorCom 2020-WL inspects MEMS and other wafer level devices for both gross and fine leaks simultaneously while automatically rejecting all leaking devices. The system accepts up to an eight inch wafer that can be optionally loaded into the machine on saw frames measuring up to eleven inches square.  The equipment is easy to setup and use, and the results can be networked to an SPC system for tracking all devices tested. It is ideal for leak testing any wafer level device that has an internal cavity. The system can inspect up to 1000 devices per cycle in both the singulated and un-singulated states.

HPx High-Pressure Dispensing Tool easily apply precise amounts of thick assembly fluids like epoxies and medical-grade adhesives through dispense tips as small as 0.004” with Nordson EFD HPx™ dispensing tools. Featuring a unique design, HPx tools increase the pressure inside disposable syringe barrels up to seven times. Designed to work with Nordson EFD air-powered dispensers, they produce a maximum dispensing pressure of 700 psi. Increase yields and produce better quality parts in less time, while minimizing the risk of repetitive stress injuries.

Next-generation and time-tested capabilities are combined in this upgraded system to increase productivity by up to 50% over the top-selling Spectrum® ll, all in a space-saving footprint. Improve UPH with swift acceleration, enhanced motion control, and IntelliJet® compatible Forte MAX dual-valve dispensing.

Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.

Key Applications

• Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
• Pre-underfill plasma treatment on flip chip packages
• Pre-mold plasma treatment on semiconductor package substrates and lead frames
• Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
• Removal/reduction of oxidation on lead frame

Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

The PD Series for plasma deposition uses a gas vapor or heated liquid monomer vapor delivery system to deposit coatings that can reduce, and in certain cases eliminate, tackiness, provide a tie layer, make surfaces more slippery or resistant to corrosion, act as a drug enhancement or inhibition agent in life sciences applications, and change desired surfaces from hydrophobic to hydrophilic or vice versa. Polymers can be directly attached to a desired surface while the chains are growing, which reduces the steps necessary for other coating processes such as grafting. This is very useful for pinhole-free coatings of 100 picometers to 1 micrometer thickness with solvent insoluble polymers.

Key Features

• Low-temperature processing because plasma energy is the catalyst for film growth.

• Plasma deposition is uniform and applies coatings evenly over curved or varied-level surfaces.
• Precise control of film thickness.
• Eliminates wet chemistry. Because polymers are deposited directly from the monomer, there are no waste streams due to wet chemical synthesis or solvents.
• Exhibits similar properties to those created via standard chemical polymerization techniques.
• Can be used in multiple steps during device manufacture: pre-treat the surface, deposit material, and apply functionalized polymer films.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP Series consists of four batch plasma treatment systems offering small, mid-size and large vacuum chamber options that deliver process correlation, controller continuity and reliable, reproducible vacuum gas plasma treatment to customers as they expand from an R&D environment to various levels of production.

Key Features

• PLC controller with touch screen provides an intuitive graphical interface and real time process representation
• Flexible shelf architecture allows processing of a wide variety of part carriers in either direct or downstream plasma mode
• 13.56 MHz RF generator has automatic impedance matching for unparalleled process reproducibility
• Proprietary software control system generates process and production data for statistical process control
• Batch style, each unit is completely self-contained, requiring minimal floor space
• The pump, chamber, control electronics, and 13.56 MHz RF generator are housed in a single enclosure