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AIM – Bar Solder
Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in a variety of wave soldering defects such as bridging, projections, and poor wetting. To avoid these is…
Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in a variety of wave soldering defects such as bridging, projections, and poor wetting. To avoid these issues, AIM’s low drossing solder bar alloys provide a high purity product exceeding IPC, JEDEC and IEC requirements.

AIM Electropure™ bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. AIM’s Electropure™ technique results in an extremely pure, low-drossing solder bar that increases throughput and decreases defects.

Key Features
- Low Oxide Content
- Reduces Defects Such as Bridging and Icicling
- Lower Surface Tension than Competitive Brands
- Available in Extruded, Cast, and Margash Bars
- Produced from High Purity Virgin Metals
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AIM – Liquid Flux and Paste Flux
AIM’s wide selection of fluxes are available in no clean, water soluble and RMA formulations engineered to provide exceptional soldering performance to fulfill demanding thru-hole and SMT assembly requirements. AIM’s flux pr…
AIM’s wide selection of fluxes are available in no clean, water soluble and RMA formulations engineered to provide exceptional soldering performance to fulfill demanding thru-hole and SMT assembly requirements. AIM’s flux products offer a broad range of benefits with proven performance in wave, selective, and rework soldering applications. AIM’s flux products are available for use with tin/lead, lead-free and low temperature solder alloys.

Key Features
- Available in VOC-Free and Alcohol Based
- Lead-Free and Tin/Lead Compatible
- Can Be Brushed, Dispensed, Pin Transferred or Stencil Printed
- For Wave, Selective and Rework Soldering
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AIM – Solder Alloys
AIM Solder provides high quality alloys and complimentary materials to the electronics industry. AIM’s variety of solder alloys provide solutions for issues commonly found within the SMT assembly industry. AIM products are pro…
AIM Solder provides high quality alloys and complimentary materials to the electronics industry. AIM’s variety of solder alloys provide solutions for issues commonly found within the SMT assembly industry. AIM products are produced using AIM’s proprietary ElectropureTM process that produce a low drossing and low oxide alloy. AIM’s solder alloys are engineered to be compatible with a variety of PCB assembly products including solder paste, solder wire, and flux.

Key Features
- Tin-silver-copper alloy in line with JEIDA recommendation
- Gold die-attach alloy
- Standard electronic assembly alloy prior to RoHS
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AIM – Solder Paste
AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high …
AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.

AIM solder paste is available in no clean, water soluble, and RMA formulations with a wide variety of alloy offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. AIM’s alloy and flux combinations provide high quality performance for a wide variety of SMT applications. In addition to SAC based SMT paste, AIM offers low temperature solder paste and jetting solder paste.

Key Features
- Lead-Free and Tin/Lead Compatible
- Halogen- and Halide-Free
- Excellent Wetting
- No Head-in-Pillow
- Low Tombstoning
- Clear Pin-Probe Testable Residue
- Extended Stencil Life and Tack Tim
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AIM – Solid and Cored Solder Wire
AIM’s complete line of solid and cored solder wire is available in a wide selection of alloys including AIM’s innovative REL alloys, lead-free and leaded solder alloys. AIM’s cored solder wire is available with no clean, w…
AIM’s complete line of solid and cored solder wire is available in a wide selection of alloys including AIM’s innovative REL alloys, lead-free and leaded solder alloys. AIM’s cored solder wire is available with no clean, water soluble and rosin flux chemistries. The combination of available alloys and novel flux chemistries offer superior soldering performance across a variety of applications, making AIM the industry’s premier solder wire manufacturer. AIM solder wire is REACH and RoHS compliant and tested to meet or exceed IPC J-STD-006 and J-STD-001 requirements.

AIM’s proprietary production methods ensure a void-free wire and consistent performance. AIM’s hand and robotic solder wires have been engineered for powerful wetting, fast thermal transfer, and high reliability across a wide range of through-hole and SMT applications. AIM solder wire is suitable for all electronic applications including consumer, automotive, LED, military and medical industries.

Key Features
- Solid and Cored Wire Available
- Lead-Free and Tin/Lead Compatible
- Excellent Wetting and Solderability
- Good Thermal Transfer
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Cool Clean – Omega™ 4000 Integrated CO2 Spray Cleaning Module
The Omega™ 4000 CO2 cleaning module provides powerful dry ice cleaning and surface preparation. The CO2 integrated spray is capable of quickly removing thin film, dust, and other surface contamination without damaging the p…

The Omega™ 4000 CO2 cleaning module provides powerful dry ice cleaning and surface preparation. The CO2 integrated spray is capable of quickly removing thin film, dust, and other surface contamination without damaging the part.

Uniquely designed, this compact cleaning unit comes in a stainless steel or powdercoated white frame. Test results have proven surfaces are prepared as good or better with the Omega™ 4000 than using etchants and dangerous solvents.

An optional, powerful combination of atmospheric plasma technology and integrated CO2 spray can be used to further break the bonds of tough organics. A final pass with CO2 spray removes the remaining debris, leaving a clean and high energy surface for bonding, coating, encapsulation, or under-fill processes.

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Cool Clean – Omega™ 5000/7000 – MobileClean™ Cleaning System
MobileClean™ brings precision cleaning exactly where it’s needed. CO2 integrated spray cleaning is powerful yet selective. Apply it only where needed to jet away oils, films and particulate matter.

MobileClean™ brings precision cleaning exactly where it’s needed. CO2 integrated spray cleaning is powerful yet selective. Apply it only where needed to jet away oils, films and particulate matter.

Our patented technology allows the operator to dial in the hardness and impact velocity of the CO2 spray particles for aggressive or mild cleaning action.

MobileClean™ is equipped with a convenient spray wand and optional on-board HEPA filtered vacuum. Simply roll up the MobileClean™, plug it in and clean.

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Cool Clean – Omega™ 8000 Integrated CO2 Spray Cleaning Module
The Omega™ 8000 CO₂ cleaning module is designed to operate 4 independent channels of CO₂ spray. By converting liquid CO₂into solid CO₂ particles that are ejected out of the noz…

The Omega™ 8000 CO₂ cleaning module is designed to operate 4 independent channels of CO₂ spray. By converting liquid CO₂into solid CO₂ particles that are ejected out of the nozzle, it is possible to clean a wide variety of substrates. The CO₂ spray is combined with heated air propellant to form a non-condensing spray, leaving behind no residue after cleaning.

The Omega™ 8000 is configured with the SmartSpray™ process, which automatically adjusts the integrated spray, using pressure and temperature control, to maintain optimum user defined spray conditions. After being fully integrated, products don’t have to be removed, cleaned and returned to the production line, resulting in reduced human interaction, higher throughput and decreased cost-of-ownership.

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ECD – Continuous Monitoring – OvenSENTINEL™
OvenSENTINEL™, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and vis…

OvenSENTINEL™, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and visibility – down to the board and profile specification level – isolating and analyzing potentially damaging process variations. Completely customizable with user-specified dashboards, expanded sensor inputs, and flexible data extractions. OvenSENTINEL allows detailed and actionable reflow process oversight.

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ECD – Dry Storasge
SmartDRY™ desiccant dry cabinet, for the storage of surface-mount technology (SMT) components with a Moisture Sensitive Level (MSL), intelligently maintains a low relative humidity (RH) as required by the IPC standard J-STD-03…

SmartDRY™ desiccant dry cabinet, for the storage of surface-mount technology (SMT) components with a Moisture Sensitive Level (MSL), intelligently maintains a low relative humidity (RH) as required by the IPC standard J-STD-033 while preventing electrostatic discharge (ESD) using durable electrically conductive powder paint surfaces over steel construction.

Fully network-capable with mobile connectivity and total accessibility from any networked device, ECD’s SmartDRY™ Intelligent Dry Storage technology enables compatibility with smart factory, Industry 4.0 operations.

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ECD – Machine Quality Management
Machine Quality Management (MQM) tools ensure soldering equipment – whether reflow, wave, or selective – is performing to specifications. Keeping a machine operating within its set tolerances sets a good foundation for product quality and high…

Machine Quality Management (MQM) tools ensure soldering equipment – whether reflow, wave, or selective – is performing to specifications. Keeping a machine operating within its set tolerances sets a good foundation for product quality and high-yield operations. ECD MQM pallets use the M.O.L.E. thermal profiler as the data collection device, enabling the use of one data acquisition system that can be used across soldering equipment platforms.

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ECD – Thermal Profiling
Thermal profiling is the recording of time and temperature throughout a thermal process – most often to measure exposure within an oven. Used in many industries, thermal profiling collects data on a product’s thermal transfo…

Thermal profiling is the recording of time and temperature throughout a thermal process – most often to measure exposure within an oven. Used in many industries, thermal profiling collects data on a product’s thermal transformation experience, which is then analyzed to optimize complex process settings and conditions to ensure quality results.

A pioneer in the design of the traveling thermal profiler, ECD has developed a suite of thermal data logging products that serve the electronics, baking, industrial and solar industries, among others.

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GETECH – Automatic Router – GAR1200
The GAR1200 is an in-line router machine specially designed to route (depanelize) large panels with PCB size up to 350mm x 310mm into individual units. It is a fast, space-saving, and accurate machine designed for high volume production with minim…

The GAR1200 is an in-line router machine specially designed to route (depanelize) large panels with PCB size up to 350mm x 310mm into individual units. It is a fast, space-saving, and accurate machine designed for high volume production with minimal operator participation. It has two worktables. While one of the worktables is in high-speed routing operation, the other worktable works with the robotic P&P module to unload boards and load the new PCB panel. This gives us 100% operational uptime without the issue of load/unload time.

Using a high-resolution CCD camera and GAR user-friendly Windows-based software allows users to program the routing paths in minutes. There are also no limitations in the number of programs stored. GAR1200 uses high-quality components and a welded steel structure to ensure rigidity and high performance. All the axes and linear guides used are protected from dust and dirt to increase lifespan and performance.

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GETECH – Fully Automatic Inline Router With Board Handling – The RBM
The RBM is a sophisticated and versatile fully-automated dual station de-panelling system. It is fitted with an auto conveyor width adjustment feature and also has various other tools to optimise the routing process based on your workflow.

The RBM is a sophisticated and versatile fully-automated dual station de-panelling system. It is fitted with an auto conveyor width adjustment feature and also has various other tools to optimise the routing process based on your workflow.

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GETECH – GSR Series Semi-auto Router Machine
The GSR series standalone routers are designed to be high performance and cost-effective solutions to meet your PCB depaneling requirements. The system allows continuous routing without stoppages and has a user-friendly software that allows the us…

The GSR series standalone routers are designed to be high performance and cost-effective solutions to meet your PCB depaneling requirements. The system allows continuous routing without stoppages and has a user-friendly software that allows the user to program the routing paths within minutes. Key components are protected from dust and dirt to increase machine performance and lifespan.

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Nordson Electronics Solutions – Automated Plasma Treatment System – FlexTRAK® SHS
Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide …
Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.

Key Applications
- Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
- Pre-underfill plasma treatment on flip chip packages
- Pre-mold plasma treatment on semiconductor package substrates and lead frames
- Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
- Removal/reduction of oxidation on lead frame
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Nordson Electronics Solutions – Plasma Polymerization Deposition System – PD Series
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surfac…
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

The PD Series for plasma deposition uses a gas vapor or heated liquid monomer vapor delivery system to deposit coatings that can reduce, and in certain cases eliminate, tackiness, provide a tie layer, make surfaces more slippery or resistant to corrosion, act as a drug enhancement or inhibition agent in life sciences applications, and change desired surfaces from hydrophobic to hydrophilic or vice versa. Polymers can be directly attached to a desired surface while the chains are growing, which reduces the steps necessary for other coating processes such as grafting. This is very useful for pinhole-free coatings of 100 picometers to 1 micrometer thickness with solvent insoluble polymers.

Key Features
- Low-temperature processing because plasma energy is the catalyst for film growth.
- Plasma deposition is uniform and applies coatings evenly over curved or varied-level surfaces.
- Precise control of film thickness.
- Eliminates wet chemistry. Because polymers are deposited directly from the monomer, there are no waste streams due to wet chemical synthesis or solvents.
- Exhibits similar properties to those created via standard chemical polymerization techniques.
- Can be used in multiple steps during device manufacture: pre-treat the surface, deposit material, and apply functionalized polymer films.
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Nordson Electronics Solutions – Plasma Systems – Sphere Series
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer t…
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.
- Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
- Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.
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Nordson Electronics Solutions – Vacuum Plasma Treatment Systems – AP Series
AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packa…

AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP Series consists of four batch plasma treatment systems offering small, mid-size and large vacuum chamber options that deliver process correlation, controller continuity and reliable, reproducible vacuum gas plasma treatment to customers as they expand from an R&D environment to various levels of production.

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Nutek – Bare Board Loader With Pass Through Mode
Bare Board Loader With Pass Through Mode is used for loading of bare PCBs to the production line.

Key Features
- Surrounded with covers to provide highest level of safe…
Bare Board Loader With Pass Through Mode is used for loading of bare PCBs to the production line.

Key Features
- Surrounded with covers to provide highest level of safety
- Top safety cover can be opened for easy access to hardware during maintenance
- User friendly ‘soft touch’ LED membrane control panel
- Adjustable suction positions provide better grips of PCBs
- Smooth and parallel width adjustment
- Small machine footprint
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Nutek – High Speed Mini Loader
This unit is used for loading of substrates, leadframes or carriers.

Key Features
- Applicable to various substrates, leadframes or carriers
- “Servo contr…
This unit is used for loading of substrates, leadframes or carriers.

Key Features
- Applicable to various substrates, leadframes or carriers
- “Servo control” lifting motion
- High speed and precise indexing
- Machine size depends on the type of magazine used
- Stores up to 10 different types of magazine dimensions
- Stainless steel magazine guide
- Pneumatic pusher’s pressure regulated
- Easy loading or unloading of magazines
- User friendly touch screen panel
- SMEMA compatible
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Nutek – Laser Marking Cell Series
Nutek – Laser Marking Cell Series 3 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

Nutek – Laser Marking Cell Series 5 unit is used to mark text, barcode, 2D code &…

Nutek – Laser Marking Cell Series 3 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

Nutek – Laser Marking Cell Series 5 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

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Nutek – Multi Function Vertical Buffer
The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during …
The Multi Function Cage-type Buffer offers multiple functions, making it adaptable to diverse manufacturing environments. It efficiently manages product flow, optimizes space utilization, and minimizes the risk of damage during transit. The buffer system’s intelligent control system ensures smooth and synchronized operations, reducing bottlenecks and enhancing overall productivity.

Key Features
- User friendly ‘soft touch’ LED membrane control panel
- First In First Out (FIFO), Last In First Out (LIFO) and pass through operating modes
- Flexible repositioning of ‘fingers’ (support bars) to accommodate jagged edge PCBs
- Durable rollers as conveying medium (no replacement of belts needed)
- Fast, smooth and precise indexing (frequency inverter controller)
- Threshold system provided
- Smooth and parallel width adjustment (leadscrew)
- Small machine footprint
- SMEMA compatible
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Nutek – NTA In-line Workstation
The NTA In-line Workstation is used to link between SMD machines or board handling units. It also allows manual assembly work to be carried out.

Key Features
- 4.3” touchscreen panel
  The NTA In-line Workstation is used to link between SMD machines or board handling units. It also allows manual assembly work to be carried out.
  
  Key Features
  
  4.3” touchscreen panel
  
  Modular design
  
  Stability enhanced by ‘robust design’
  
  Laser carved stainless steel side guides for superior quality and durability
  
  PCB inspection mode provided
  
  Servo motor controlled width adjustment
  
  Different lengths available upon request
  
  Multi-zone concept available upon request
  
  Equipped with lighting features, single layer part tray and foot rest
  
  Equipped with ESD scallop table and ESD bracelet connection
  
  Variable speed control
  
  Patented (SG Patent No.: 91261)
  
  Programmable product setting
  
  Industry 4.0 ready
  
  OPC UA ready
  
  CANOpen communication ready
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