ADT – Dicing Saw
Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.
Key Features
- New User Interface (NUI) Upgrade Kit
- Dicing Floor Management (DFM)
- Height Measurement Tool (HMT)
- Dressing Procedure
Available Models
Technical Spcifications
| Specifications | 8030 |
|---|---|
| Workpiece Size | Ø 8”, Ø 12″ or 12″ × 12″ Square |
| Blade Size | 2” – 3” |
| X Axis | Air Slide |
| Cleaning Method | Atomized cleaning capabilities |
| Dimensions (W × D × H) mm | 1,145 × 1,687 × 1,830 1,500 |
ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8030 is a high accuracy system that can dice product up to 12” in diameter or 12” × 12” product, at high performances and low cost of operation.
Key Features
- Flexibility – Supports Hub and Hubless blades up to 3” O.D.
- Spindles of 1.8 kW or 2.2 kW high power
- Bridge type frame supporting efficient wafer processing
Technical Spcifications
| Specifications | 8020 |
|---|---|
| Workpiece Size | Ø 8” |
| Blade Size | 2” – 3” |
| X Axis | Air Slide |
| Cleaning Method | Atomized cleaning capabilities |
| Dimensions (W × D × H) mm | 1,015 × 1,460 × 1,820 1,300 |
ADT 8020 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice product up to 8” in diameter, at high performances and low cost of operation.
Key Features
- Flexibility – Supports Hub and Hubless blades up to 3” O.D.
- Spindles of 1.8 kW or 2.2 kW high power
- Intuitive operation interface using a large 19” touch screen monitor
Technical Spcifications
| Specifications | 7900 Duo | 7920 Duo | 7930 Duo |
|---|---|---|---|
| Workpiece Size | Ø 8″ | 10″ × 10″ | 12″ × 10″ or Ø 12″ |
| Blade Size | 2” – 3” | 2” – 3” | 2” – 3” |
| X Axis | Air Slide | Air Slide | Air Slide |
| θ Axis, Repeatability | 4 arc-sec | 4 arc-sec | 4 arc-sec |
| Dimensions (W × D × H) mm | 875 × 975 × 1450 | 875 × 975 × 1450 | 875 × 975 × 1450 |
ADT 7900 series has two facing spindles that can simultaneously dice wafers or packages at high throughput. ADT 7900 series is a high accuracy system that can dice product at high performances and low cost of operation.
Key Features
- Simple Blade Change
- SECS/GEM platform ready
- Full access to any area of the system for easy maintenance
Technical Spcifications
| Specifications | 7122 | 7124 | 7132 | 7134 |
|---|---|---|---|---|
| Workpiece Size | Ø 8″ | Ø 8″ | Ø 12″ or 300mm × 300mm W/O frame | Ø 12″ or 300mm × 300mm W/O frame |
| Blade Size | 2” – 3” | 4” – 5” | 2” – 3” | 4” – 5” |
| X Axis | Air Slide | Air Slide | Air Slide | Air Slide |
| θ Axis, Repeatability | 4 arc-sec | 4 arc-sec | 4 arc-sec | 4 arc-sec |
| Dimensions (W × D × H) mm | 965 × 1300 × 1600 | 965 × 1300 × 1600 | 965 × 1300 × 1600 | 965 × 1300 × 1600 |
The 7120 / 7130 families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility to support your needs.
Key Features
- Support 2″-3″ and 4″-5″ blade O.D. with large ‘Z’ stroke
- ‘X’ axis air bearing for smooth motion and super cut quality
- Automation with high resolution optics
Technical Spcifications
| Specifications | 7222 | 7223 | 7224 |
|---|---|---|---|
| Workpiece Size | Ø 8″ | Ø 8″ | Ø 8″ |
| Blade Size | 2” – 3” | 4” – 5” | 2” – 3” |
| X Axis | Air Slide | Air Slide | Air Slide |
| θ Axis, Repeatability | 4 arc-sec | 4 arc-sec | 4 arc-sec |
| Dimensions (W × D × H) mm | 965 × 1460 × 1700 | 965 × 1460 × 1700 | 965 × 1460 × 1700 |
The 7200 system offers a wide range of advanced automation and process monitoring option to meet the throughput and quality requirements of your most challenging dicing applications: silicon, glass on silicon, glass, BGA & QFN packages, LTCC, ceramic, PCB and other hard material applications.
Key Features
- Efficient wafer handling system
- Continuous digital magnifications vision system
- Blade wear prediction algorithm reduces height measurement time and increases UPH
ADT Dicing Saws
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