OvenSENTINEL™, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and visibility – down to the board and profile specification level – isolating and analyzing potentially damaging process variations. Completely customizable with user-specified dashboards, expanded sensor inputs, and flexible data extractions. OvenSENTINEL allows detailed and actionable reflow process oversight.

SmartDRY™ desiccant dry cabinet, for the storage of surface-mount technology (SMT) components with a Moisture Sensitive Level (MSL), intelligently maintains a low relative humidity (RH) as required by the IPC standard J-STD-033 while preventing electrostatic discharge (ESD) using durable electrically conductive powder paint surfaces over steel construction.

Fully network-capable with mobile connectivity and total accessibility from any networked device, ECD’s SmartDRY™ Intelligent Dry Storage technology enables compatibility with smart factory, Industry 4.0 operations.

Machine Quality Management (MQM) tools ensure soldering equipment – whether reflow, wave, or selective – is performing to specifications. Keeping a machine operating within its set tolerances sets a good foundation for product quality and high-yield operations. ECD MQM pallets use the M.O.L.E. thermal profiler as the data collection device, enabling the use of one data acquisition system that can be used across soldering equipment platforms.

Thermal profiling is the recording of time and temperature throughout a thermal process – most often to measure exposure within an oven. Used in many industries, thermal profiling collects data on a product’s thermal transformation experience, which is then analyzed to optimize complex process settings and conditions to ensure quality results.

A pioneer in the design of the traveling thermal profiler, ECD has developed a suite of thermal data logging products that serve the electronics, baking, industrial and solar industries, among others.

FoxSign fully understands that our success is attributable to our customers and the society to which we all belong. As a global citizen, FoxSign is determined to make significant contributions to society various accessible process equipments through the experiences and technical abilities we already have.

Our service covered 4 main Deflash processes:

1. Electrolysis Deflash – ED
2. Chemical Deflash – CD
3. Water Jet Deflash – WJ
4. Wet Blasting Deflash – WB

The GAR1200 is an in-line router machine specially designed to route (depanelize) large panels with PCB size up to 350mm x 310mm into individual units. It is a fast, space-saving, and accurate machine designed for high volume production with minimal operator participation. It has two worktables. While one of the worktables is in high-speed routing operation, the other worktable works with the robotic P&P module to unload boards and load the new PCB panel. This gives us 100% operational uptime without the issue of load/unload time.

Using a high-resolution CCD camera and GAR user-friendly Windows-based software allows users to program the routing paths in minutes. There are also no limitations in the number of programs stored. GAR1200 uses high-quality components and a welded steel structure to ensure rigidity and high performance. All the axes and linear guides used are protected from dust and dirt to increase lifespan and performance.

The RBM is a sophisticated and versatile fully-automated dual station de-panelling system. It is fitted with an auto conveyor width adjustment feature and also has various other tools to optimise the routing process based on your workflow.

The GSR series standalone routers are designed to be high performance and cost-effective solutions to meet your PCB depaneling requirements. The system allows continuous routing without stoppages and has a user-friendly software that allows the user to program the routing paths within minutes. Key components are protected from dust and dirt to increase machine performance and lifespan.

A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum offset and home run features. Upgraded cutter motors and drive geometry give over 8000 max RPM at the spindle.

Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.

Key Applications

• Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
• Pre-underfill plasma treatment on flip chip packages
• Pre-mold plasma treatment on semiconductor package substrates and lead frames
• Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
• Removal/reduction of oxidation on lead frame

Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

The PD Series for plasma deposition uses a gas vapor or heated liquid monomer vapor delivery system to deposit coatings that can reduce, and in certain cases eliminate, tackiness, provide a tie layer, make surfaces more slippery or resistant to corrosion, act as a drug enhancement or inhibition agent in life sciences applications, and change desired surfaces from hydrophobic to hydrophilic or vice versa. Polymers can be directly attached to a desired surface while the chains are growing, which reduces the steps necessary for other coating processes such as grafting. This is very useful for pinhole-free coatings of 100 picometers to 1 micrometer thickness with solvent insoluble polymers.

Key Features

• Low-temperature processing because plasma energy is the catalyst for film growth.

• Plasma deposition is uniform and applies coatings evenly over curved or varied-level surfaces.
• Precise control of film thickness.
• Eliminates wet chemistry. Because polymers are deposited directly from the monomer, there are no waste streams due to wet chemical synthesis or solvents.
• Exhibits similar properties to those created via standard chemical polymerization techniques.
• Can be used in multiple steps during device manufacture: pre-treat the surface, deposit material, and apply functionalized polymer films.

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

• Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
• Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP Series consists of four batch plasma treatment systems offering small, mid-size and large vacuum chamber options that deliver process correlation, controller continuity and reliable, reproducible vacuum gas plasma treatment to customers as they expand from an R&D environment to various levels of production.

Bare Board Loader With Pass Through Mode is used for loading of bare PCBs to the production line.

Key Features

• Surrounded with covers to provide highest level of safety
• Top safety cover can be opened for easy access to hardware during maintenance
• User friendly ‘soft touch’ LED membrane control panel
• Adjustable suction positions provide better grips of PCBs
• Smooth and parallel width adjustment
• Small machine footprint