Semiconductor and Electronics

Showing 1–24 of 38 results

ADT – Dicing Blades
ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades…
ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

Key Features
- Designed for cutting hard and brittle materials
- Minimizes chipping and cracking
- Long-lasting performance
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ADT – Dicing Peripheral
ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and ex…
ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

Key Features
- Used for dicing wafers and substrates into smaller chips
- High accuracy and low kerf loss for optimal yield
- Compatible with a wide range of materials and thicknesses
- Robust and durable design for long-term use
- Offers advanced automated blade height adjustment and real-time monitoring.
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ADT – Dicing Saw
Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. …
Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.

Key Features
- New User Interface (NUI) Upgrade Kit
- Dicing Floor Management (DFM)
- Height Measurement Tool (HMT)
- Dressing Procedure
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ATV – SRO i-Line
The all-new and groundbreaking SRO i-Line is a high volume production tool used for vacuum reflow soldering. Implementing this tool within the ATV single chamber approach will help to fulfil all your current and future …
The all-new and groundbreaking SRO i-Line is a high volume production tool used for vacuum reflow soldering. Implementing this tool within the ATV single chamber approach will help to fulfil all your current and future demands. Since 1982 ATV‘s single chamber approach has proven equally successful in the R&D and pilot line production market.

With more than 550 devices in use worldwide ATV is ready to step into high volume production with its brand-new SRO i-Line. This system can easily be upgraded from the basic one process chamber version to three process chambers all within the same footprint. Each chamber is individually programmable to perform its own process. This allows for the most flexible solution within your production.

Key Features
- High Throughput
- Short Cycle Times
- Formic Acid
- Process Temperature Up To 450°c Temperature Ramp-up Rate 3k/sec.
- Temperature Cool-down Rate 2k/sec.
- Excellent Temperature Uniformity
- IR Heating
- Small Footprint (No Footprint Change Up To 3 Process Chambers)
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ATV – SRO-700
This table top soldering system is the ideal tool for R&D applications. With its rapid thermal annealing and brazing capabilities the SRO-700 is equally suited for your basic reflow soldering applications as well as all your…
This table top soldering system is the ideal tool for R&D applications. With its rapid thermal annealing and brazing capabilities the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.

With its 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. The SRO-700 is an incredibly versatile reflow oven for semiconductor and MEMS application. Whatever the objective the SRO-700 is ready to handle it all.

Key Features
- Formic Acid Enriched Atmosphere
- Direct IR Heating
- Multiple TC monitoring
- Process temperature 450°C
- Oxygen < 1,0ppm with PURIFIED N2
- 100 steps/RECIPE program
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ATV – SRO-706 Getter
ATV’s approach using the Cold Wall Process Chamber is also applied in the SRO-706 Getter system. This system can be applied for Thermal Getter processes in R&D and Production line applications. The basis for the Getter sys…
ATV’s approach using the Cold Wall Process Chamber is also applied in the SRO-706 Getter system. This system can be applied for Thermal Getter processes in R&D and Production line applications. The basis for the Getter system is the successful SRO-706 series IR vacuum reflow oven. Common applications are sealing of packages with kovar caps or optical windows for gyroscopes, microbolometer and various MEMS sensors under high vacuum by applying thermal Getter activation.

With its proven direct IR heating approach, ATV applies for the SRO-706 Getter system a top and bottom heating. The IR lamp arrays are independently monitored and controlled as 2 separate heating zones. This results that there is an excellent heating uniformity under vacuum when reaching a maximum temperature of 450°C during the Thermal getter process. The sensor or chip temperature remains below 100°C during the getter activation process. Optionally, a mass spectrometer can be added for residual gas analysis during the sealing process.

The SRO-706 Getter is a result of in-depth cooperation with our customer base and listing to the needs of the market as you may expect form ATV.

Key Features
- Programmable solder reflow oven
- Thermal reactor
- High vacuum package lid sealing system
- Thermal getter activation
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ATV – SRO-716
The ATV SRO-716 series standalone IR vacuum reflow ovens are the benchmark for R&D, low volume pilot line and medium volume batch production. The system produces high quality results with outstanding process stability and re…
The ATV SRO-716 series standalone IR vacuum reflow ovens are the benchmark for R&D, low volume pilot line and medium volume batch production. The system produces high quality results with outstanding process stability and repeatability. Configuration dependent, process capabilities include: flux-less soldering, eutectic die attach, gold tin soldering, void-free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.

Key Features
- Small Footprint, Freestanding Vacuum Reflow Oven
- Touch TCs with Quick Swap Hotplates
- Maximum Temperature 450°C, (optional 700°C)
- Temperature ramp-up rate 3.5K/sec
- Up to 100 process steps per profile recipe
- Automatic Chamber Opening / Closing
- Optional Top Heating
- Heated Area: 314 x 314 mm
- Oxygen < 1 ppm
- Optional High-Pressure Atmosphere: up to 3 bar (abs)
- Formic Acid, H2 or Solder Paste Activation
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Cool Clean – Omega™ 4000 Integrated CO2 Spray Cleaning Module
The Omega™ 4000 CO2 cleaning module provides powerful dry ice cleaning and surface preparation. The CO2 integrated spray is capable of quickly removing thin film, dust, and other surface contamination without damaging the p…

The Omega™ 4000 CO2 cleaning module provides powerful dry ice cleaning and surface preparation. The CO2 integrated spray is capable of quickly removing thin film, dust, and other surface contamination without damaging the part.

Uniquely designed, this compact cleaning unit comes in a stainless steel or powdercoated white frame. Test results have proven surfaces are prepared as good or better with the Omega™ 4000 than using etchants and dangerous solvents.

An optional, powerful combination of atmospheric plasma technology and integrated CO2 spray can be used to further break the bonds of tough organics. A final pass with CO2 spray removes the remaining debris, leaving a clean and high energy surface for bonding, coating, encapsulation, or under-fill processes.

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Cool Clean – Omega™ 5000/7000 – MobileClean™ Cleaning System
MobileClean™ brings precision cleaning exactly where it’s needed. CO2 integrated spray cleaning is powerful yet selective. Apply it only where needed to jet away oils, films and particulate matter.

MobileClean™ brings precision cleaning exactly where it’s needed. CO2 integrated spray cleaning is powerful yet selective. Apply it only where needed to jet away oils, films and particulate matter.

Our patented technology allows the operator to dial in the hardness and impact velocity of the CO2 spray particles for aggressive or mild cleaning action.

MobileClean™ is equipped with a convenient spray wand and optional on-board HEPA filtered vacuum. Simply roll up the MobileClean™, plug it in and clean.

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Cool Clean – Omega™ 8000 Integrated CO2 Spray Cleaning Module
The Omega™ 8000 CO₂ cleaning module is designed to operate 4 independent channels of CO₂ spray. By converting liquid CO₂into solid CO₂ particles that are ejected out of the noz…

The Omega™ 8000 CO₂ cleaning module is designed to operate 4 independent channels of CO₂ spray. By converting liquid CO₂into solid CO₂ particles that are ejected out of the nozzle, it is possible to clean a wide variety of substrates. The CO₂ spray is combined with heated air propellant to form a non-condensing spray, leaving behind no residue after cleaning.

The Omega™ 8000 is configured with the SmartSpray™ process, which automatically adjusts the integrated spray, using pressure and temperature control, to maintain optimum user defined spray conditions. After being fully integrated, products don’t have to be removed, cleaned and returned to the production line, resulting in reduced human interaction, higher throughput and decreased cost-of-ownership.

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ECD – Continuous Monitoring – OvenSENTINEL™
OvenSENTINEL™, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and vis…

OvenSENTINEL™, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and visibility – down to the board and profile specification level – isolating and analyzing potentially damaging process variations. Completely customizable with user-specified dashboards, expanded sensor inputs, and flexible data extractions. OvenSENTINEL allows detailed and actionable reflow process oversight.

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ECD – Dry Storasge
SmartDRY™ desiccant dry cabinet, for the storage of surface-mount technology (SMT) components with a Moisture Sensitive Level (MSL), intelligently maintains a low relative humidity (RH) as required by the IPC standard J-STD-03…

SmartDRY™ desiccant dry cabinet, for the storage of surface-mount technology (SMT) components with a Moisture Sensitive Level (MSL), intelligently maintains a low relative humidity (RH) as required by the IPC standard J-STD-033 while preventing electrostatic discharge (ESD) using durable electrically conductive powder paint surfaces over steel construction.

Fully network-capable with mobile connectivity and total accessibility from any networked device, ECD’s SmartDRY™ Intelligent Dry Storage technology enables compatibility with smart factory, Industry 4.0 operations.

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ECD – Machine Quality Management
Machine Quality Management (MQM) tools ensure soldering equipment – whether reflow, wave, or selective – is performing to specifications. Keeping a machine operating within its set tolerances sets a good foundation for product quality and high…

Machine Quality Management (MQM) tools ensure soldering equipment – whether reflow, wave, or selective – is performing to specifications. Keeping a machine operating within its set tolerances sets a good foundation for product quality and high-yield operations. ECD MQM pallets use the M.O.L.E. thermal profiler as the data collection device, enabling the use of one data acquisition system that can be used across soldering equipment platforms.

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ECD – Thermal Profiling
Thermal profiling is the recording of time and temperature throughout a thermal process – most often to measure exposure within an oven. Used in many industries, thermal profiling collects data on a product’s thermal transfo…

Thermal profiling is the recording of time and temperature throughout a thermal process – most often to measure exposure within an oven. Used in many industries, thermal profiling collects data on a product’s thermal transformation experience, which is then analyzed to optimize complex process settings and conditions to ensure quality results.

A pioneer in the design of the traveling thermal profiler, ECD has developed a suite of thermal data logging products that serve the electronics, baking, industrial and solar industries, among others.

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Foxsign – Stereocirculatory Electrolysis Wet Blasting Deflash
FoxSign fully understands that our success is attributable to our customers and the society to which we all belong. As a global citizen, FoxSign is determined to make significant contributions to society various accessible proce…
FoxSign fully understands that our success is attributable to our customers and the society to which we all belong. As a global citizen, FoxSign is determined to make significant contributions to society various accessible process equipments through the experiences and technical abilities we already have.

Our service covered 4 main Deflash processes:
1. Electrolysis Deflash – ED
2. Chemical Deflash – CD
3. Water Jet Deflash – WJ
4. Wet Blasting Deflash – WB
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Midas – D5 Series de-idder™
A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum…

A massive flat-rail and carriage module replaced the decades old round rail system. Chassis structure was heavily reinforced with interlocked walls and castings. Table drive is the servomotor system used on the DL-4A; with datum offset and home run features. Upgraded cutter motors and drive geometry give over 8000 max RPM at the spindle.

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Midas – Hot Gas Rework System

The HGRS-1J

The HGRS-1J is a compact, economical single-jet tool giving high temp performance without “the extras”. This is a great solution for specific applications (thermal test, fiber attach, small die removal) and for labs needing more thermal performance than air heaters can provide.

The HGRS-V is a highly adaptable dual-jet “thermal workbench” with a comprehensive suite of circuit-protective features. It’s the ideal solution for those facing a variety of rework tasks involving large die, eutectic attach, double-sided devices or other assemblies with tight thermal constraints.

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Nordson Electronics Solutions – Automated Plasma Treatment System – FlexTRAK® SHS
Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide …
Industry-Leading Throughput and Reliability

Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.

Key Applications
- Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
- Pre-underfill plasma treatment on flip chip packages
- Pre-mold plasma treatment on semiconductor package substrates and lead frames
- Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
- Removal/reduction of oxidation on lead frame
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Nordson Electronics Solutions – Plasma Polymerization Deposition System – PD Series
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surfac…
Nordson Electronics Solutions introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

The PD Series for plasma deposition uses a gas vapor or heated liquid monomer vapor delivery system to deposit coatings that can reduce, and in certain cases eliminate, tackiness, provide a tie layer, make surfaces more slippery or resistant to corrosion, act as a drug enhancement or inhibition agent in life sciences applications, and change desired surfaces from hydrophobic to hydrophilic or vice versa. Polymers can be directly attached to a desired surface while the chains are growing, which reduces the steps necessary for other coating processes such as grafting. This is very useful for pinhole-free coatings of 100 picometers to 1 micrometer thickness with solvent insoluble polymers.

Key Features
- Low-temperature processing because plasma energy is the catalyst for film growth.
- Plasma deposition is uniform and applies coatings evenly over curved or varied-level surfaces.
- Precise control of film thickness.
- Eliminates wet chemistry. Because polymers are deposited directly from the monomer, there are no waste streams due to wet chemical synthesis or solvents.
- Exhibits similar properties to those created via standard chemical polymerization techniques.
- Can be used in multiple steps during device manufacture: pre-treat the surface, deposit material, and apply functionalized polymer films.
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Nordson Electronics Solutions – Plasma Systems – Sphere Series
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer t…
SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.
- Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
- Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.
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Nordson Electronics Solutions – Vacuum Plasma Treatment Systems – AP Series
AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packa…

AP series plasma treatment machines are suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP Series consists of four batch plasma treatment systems offering small, mid-size and large vacuum chamber options that deliver process correlation, controller continuity and reliable, reproducible vacuum gas plasma treatment to customers as they expand from an R&D environment to various levels of production.

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Nutek – Bare Board Loader With Pass Through Mode
Bare Board Loader With Pass Through Mode is used for loading of bare PCBs to the production line.

Key Features
- Surrounded with covers to provide highest level of safe…
Bare Board Loader With Pass Through Mode is used for loading of bare PCBs to the production line.

Key Features
- Surrounded with covers to provide highest level of safety
- Top safety cover can be opened for easy access to hardware during maintenance
- User friendly ‘soft touch’ LED membrane control panel
- Adjustable suction positions provide better grips of PCBs
- Smooth and parallel width adjustment
- Small machine footprint
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Nutek – High Speed Mini Loader
This unit is used for loading of substrates, leadframes or carriers.

Key Features
- Applicable to various substrates, leadframes or carriers
- “Servo contr…
This unit is used for loading of substrates, leadframes or carriers.

Key Features
- Applicable to various substrates, leadframes or carriers
- “Servo control” lifting motion
- High speed and precise indexing
- Machine size depends on the type of magazine used
- Stores up to 10 different types of magazine dimensions
- Stainless steel magazine guide
- Pneumatic pusher’s pressure regulated
- Easy loading or unloading of magazines
- User friendly touch screen panel
- SMEMA compatible
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Nutek – Laser Marking Cell Series
Nutek – Laser Marking Cell Series 3 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

Nutek – Laser Marking Cell Series 5 unit is used to mark text, barcode, 2D code &…

Nutek – Laser Marking Cell Series 3 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

Nutek – Laser Marking Cell Series 5 unit is used to mark text, barcode, 2D code & graphic onto PCBs.

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