ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

Key Features

• Designed for cutting hard and brittle materials
• Minimizes chipping and cracking
• Long-lasting performance

ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

 

Key Features

• Used for dicing wafers and substrates into smaller chips
• High accuracy and low kerf loss for optimal yield
• Compatible with a wide range of materials and thicknesses
• Robust and durable design for long-term use
• Offers advanced automated blade height adjustment and real-time monitoring.

AIM’s wide selection of fluxes are available in no clean, water soluble and RMA formulations engineered to provide exceptional soldering performance to fulfill demanding thru-hole and SMT assembly requirements. AIM’s flux products offer a broad range of benefits with proven performance in wave, selective, and rework soldering applications. AIM’s flux products are available for use with tin/lead, lead-free and low temperature solder alloys.

Key Features

• Available in VOC-Free and Alcohol Based
• Lead-Free and Tin/Lead Compatible
• Can Be Brushed, Dispensed, Pin Transferred or Stencil Printed
• For Wave, Selective and Rework Soldering

AIM Solder provides high quality alloys and complimentary materials to the electronics industry. AIM’s variety of solder alloys provide solutions for issues commonly found within the SMT assembly industry. AIM products are produced using AIM’s proprietary ElectropureTM process that produce a low drossing and low oxide alloy. AIM’s solder alloys are engineered to be compatible with a variety of PCB assembly products including solder paste, solder wire, and flux.

Key Features

• Tin-silver-copper alloy in line with JEIDA recommendation
• Gold die-attach alloy
• Standard electronic assembly alloy prior to RoHS

AIM’s complete line of solid and cored solder wire is available in a wide selection of alloys including AIM’s innovative REL alloys, lead-free and leaded solder alloys. AIM’s cored solder wire is available with no clean, water soluble and rosin flux chemistries. The combination of available alloys and novel flux chemistries offer superior soldering performance across a variety of applications, making AIM the industry’s premier solder wire manufacturer. AIM solder wire is REACH and RoHS compliant and tested to meet or exceed IPC J-STD-006 and J-STD-001 requirements.

AIM’s proprietary production methods ensure a void-free wire and consistent performance. AIM’s hand and robotic solder wires have been engineered for powerful wetting, fast thermal transfer, and high reliability across a wide range of through-hole and SMT applications. AIM solder wire is suitable for all electronic applications including consumer, automotive, LED, military and medical industries.

Key Features

• Solid and Cored Wire Available
• Lead-Free and Tin/Lead Compatible
• Excellent Wetting and Solderability
• Good Thermal Transfer

The Omega™ 4000 CO2 cleaning module provides powerful dry ice cleaning and surface preparation. The CO2 integrated spray is capable of quickly removing thin film, dust, and other surface contamination without damaging the part.

Uniquely designed, this compact cleaning unit comes in a stainless steel or powdercoated white frame. Test results have proven surfaces are prepared as good or better with the Omega™ 4000 than using etchants and dangerous solvents.

An optional, powerful combination of atmospheric plasma technology and integrated CO2 spray can be used to further break the bonds of tough organics. A final pass with CO2 spray removes the remaining debris, leaving a clean and high energy surface for bonding, coating, encapsulation, or under-fill processes.

Key Features

• Selective submicron particle removal from Hard Disk Drive assemblies
• Adhesive bonding with atmospheric plasma and CO2
• Cleaning with non-contact surface inspection

The Omega™ 8000 CO₂ cleaning module is designed to operate 4 independent channels of CO₂ spray. By converting liquid CO₂ into solid CO₂ particles that are ejected out of the nozzle, it is possible to clean a wide variety of substrates. The CO₂ spray is combined with heated air propellant to form a non-condensing spray, leaving behind no residue after cleaning.

The Omega™ 8000 is configured with the SmartSpray™ process, which automatically adjusts the integrated spray, using pressure and temperature control, to maintain optimum user defined spray conditions. After being fully integrated, products don’t have to be removed, cleaned and returned to the production line, resulting in reduced human interaction, higher throughput and decreased cost-of-ownership.

Key Features

• 4 independently controlled and monitored nozzles
• Automated metering valve control on each channel
• Interface with exterior systems for individual channels
• Automated propellant pressure control
• Selective sub-micron particle, ionic and thin film removal

OvenSENTINEL™, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and visibility – down to the board and profile specification level – isolating and analyzing potentially damaging process variations. Completely customizable with user-specified dashboards, expanded sensor inputs, and flexible data extractions. OvenSENTINEL allows detailed and actionable reflow process oversight.

Key Features

• Dynamic Measurement Capabilities
• Continuous Quality Monitoring
• Automated Thermal Profiling
• Full-featured Traceability
• Ovensentinel™ Software

SmartDRY™ desiccant dry cabinet, for the storage of surface-mount technology (SMT) components with a Moisture Sensitive Level (MSL), intelligently maintains a low relative humidity (RH) as required by the IPC standard J-STD-033 while preventing electrostatic discharge (ESD) using durable electrically conductive powder paint surfaces over steel construction.

Fully network-capable with mobile connectivity and total accessibility from any networked device, ECD’s SmartDRY™ Intelligent Dry Storage technology enables compatibility with smart factory, Industry 4.0 operations.

Key Features

• Fast Recovery Time
• Intelligent Light Status
• Network Capable
• Easy-to-use
• Exceptional Quality
• Touch Display

Machine Quality Management (MQM) tools ensure soldering equipment – whether reflow, wave, or selective – is performing to specifications. Keeping a machine operating within its set tolerances sets a good foundation for product quality and high-yield operations. ECD MQM pallets use the M.O.L.E. thermal profiler as the data collection device, enabling the use of one data acquisition system that can be used across soldering equipment platforms.

Thermal profiling is the recording of time and temperature throughout a thermal process – most often to measure exposure within an oven. Used in many industries, thermal profiling collects data on a product’s thermal transformation experience, which is then analyzed to optimize complex process settings and conditions to ensure quality results.

A pioneer in the design of the traveling thermal profiler, ECD has developed a suite of thermal data logging products that serve the electronics, baking, industrial and solar industries, among others.

FoxSign fully understands that our success is attributable to our customers and the society to which we all belong. As a global citizen, FoxSign is determined to make significant contributions to society various accessible process equipments through the experiences and technical abilities we already have.

Our service covered 4 main Deflash processes:

1. Electrolysis Deflash – ED
2. Chemical Deflash – CD
3. Water Jet Deflash – WJ
4. Wet Blasting Deflash – WB

The GAR1200 is an in-line router machine specially designed to route (depanelize) large panels with PCB size up to 350mm x 310mm into individual units. It is a fast, space-saving, and accurate machine designed for high volume production with minimal operator participation. It has two worktables. While one of the worktables is in high-speed routing operation, the other worktable works with the robotic P&P module to unload boards and load the new PCB panel. This gives us 100% operational uptime without the issue of load/unload time.

Using a high-resolution CCD camera and GAR user-friendly Windows-based software allows users to program the routing paths in minutes. There are also no limitations in the number of programs stored. GAR1200 uses high-quality components and a welded steel structure to ensure rigidity and high performance. All the axes and linear guides used are protected from dust and dirt to increase lifespan and performance.

The RBM is a sophisticated and versatile fully-automated dual station de-panelling system. It is fitted with an auto conveyor width adjustment feature and also has various other tools to optimise the routing process based on your workflow.