ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

Key Features

• Designed for cutting hard and brittle materials
• Minimizes chipping and cracking
• Long-lasting performance

ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

 

Key Features

• Used for dicing wafers and substrates into smaller chips
• High accuracy and low kerf loss for optimal yield
• Compatible with a wide range of materials and thicknesses
• Robust and durable design for long-term use
• Offers advanced automated blade height adjustment and real-time monitoring.

Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.

Key Features 

• New User Interface (NUI) Upgrade Kit
• Dicing Floor Management (DFM)
• Height Measurement Tool (HMT)
• Dressing Procedure

Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in a variety of wave soldering defects such as bridging, projections, and poor wetting. To avoid these issues, AIM’s low drossing solder bar alloys provide a high purity product exceeding IPC, JEDEC and IEC requirements.

AIM Electropure™ bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. AIM’s Electropure™ technique results in an extremely pure, low-drossing solder bar that increases throughput and decreases defects.

Key Features

• Low Oxide Content
• Reduces Defects Such as Bridging and Icicling
•  Lower Surface Tension than Competitive Brands
• Available in Extruded, Cast, and Margash Bars
• Produced from High Purity Virgin Metals

AIM’s wide selection of fluxes are available in no clean, water soluble and RMA formulations engineered to provide exceptional soldering performance to fulfill demanding thru-hole and SMT assembly requirements. AIM’s flux products offer a broad range of benefits with proven performance in wave, selective, and rework soldering applications. AIM’s flux products are available for use with tin/lead, lead-free and low temperature solder alloys.

Key Features

• Available in VOC-Free and Alcohol Based
• Lead-Free and Tin/Lead Compatible
• Can Be Brushed, Dispensed, Pin Transferred or Stencil Printed
• For Wave, Selective and Rework Soldering

AIM Solder provides high quality alloys and complimentary materials to the electronics industry. AIM’s variety of solder alloys provide solutions for issues commonly found within the SMT assembly industry. AIM products are produced using AIM’s proprietary ElectropureTM process that produce a low drossing and low oxide alloy. AIM’s solder alloys are engineered to be compatible with a variety of PCB assembly products including solder paste, solder wire, and flux.

Key Features

• Tin-silver-copper alloy in line with JEIDA recommendation
• Gold die-attach alloy
• Standard electronic assembly alloy prior to RoHS

AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.

AIM solder paste is available in no clean, water soluble, and RMA formulations with a wide variety of alloy offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. AIM’s alloy and flux combinations provide high quality performance for a wide variety of SMT applications. In addition to SAC based SMT paste, AIM offers low temperature solder paste and jetting solder paste.

Key Features

• Lead-Free and Tin/Lead Compatible
• Halogen- and Halide-Free
• Excellent Wetting
• No Head-in-Pillow
• Low Tombstoning
• Clear Pin-Probe Testable Residue
• Extended Stencil Life and Tack Tim

AIM’s complete line of solid and cored solder wire is available in a wide selection of alloys including AIM’s innovative REL alloys, lead-free and leaded solder alloys. AIM’s cored solder wire is available with no clean, water soluble and rosin flux chemistries. The combination of available alloys and novel flux chemistries offer superior soldering performance across a variety of applications, making AIM the industry’s premier solder wire manufacturer. AIM solder wire is REACH and RoHS compliant and tested to meet or exceed IPC J-STD-006 and J-STD-001 requirements.

AIM’s proprietary production methods ensure a void-free wire and consistent performance. AIM’s hand and robotic solder wires have been engineered for powerful wetting, fast thermal transfer, and high reliability across a wide range of through-hole and SMT applications. AIM solder wire is suitable for all electronic applications including consumer, automotive, LED, military and medical industries.

Key Features

• Solid and Cored Wire Available
• Lead-Free and Tin/Lead Compatible
• Excellent Wetting and Solderability
• Good Thermal Transfer

The all-new and groundbreaking SRO i-Line is a high volume production tool used for vacuum reflow soldering. Implementing this tool within the ATV single chamber approach will help to fulfil all your current and future demands. Since 1982 ATV‘s single chamber approach has proven equally successful in the R&D and pilot line production market.

With more than 550 devices in use worldwide ATV is ready to step into high volume production with its brand-new SRO i-Line. This system can easily be upgraded from the basic one process chamber version to three process chambers all within the same footprint. Each chamber is individually programmable to perform its own process. This allows for the most flexible solution within your production.

Key Features

• High Throughput
• Short Cycle Times
• Formic Acid
• Process Temperature Up To 450°c Temperature Ramp-up Rate 3k/sec.
• Temperature Cool-down Rate 2k/sec.
• Excellent Temperature Uniformity
• IR Heating
• Small Footprint (No Footprint Change Up To 3 Process Chambers)

This table top soldering system is the ideal tool for R&D applications. With its rapid thermal annealing and brazing capabilities the SRO-700 is equally suited for your basic reflow soldering applications as well as all your R&D assignments. A cold wall chamber principle in combination with the IR lamp heating technology and the vacuum option will reward you with all the required process repeatability and perfect void free solder joints.

With its 100 mm clearance over the heated surface the system can handle products like IGBT and power electronics packages. The SRO-700 is an incredibly versatile reflow oven for semiconductor and MEMS application. Whatever the objective the SRO-700 is ready to handle it all.

Key Features

• Formic Acid Enriched Atmosphere
• Direct IR Heating
• Multiple TC monitoring
• Process temperature 450°C
• Oxygen < 1,0ppm with PURIFIED N2
• 100 steps/RECIPE program

ATV’s approach using the Cold Wall Process Chamber is also applied in the SRO-706 Getter system. This system can be applied for Thermal Getter processes in R&D and Production line applications. The basis for the Getter system is the successful SRO-706 series IR vacuum reflow oven. Common applications are sealing of packages with kovar caps or optical windows for gyroscopes, microbolometer and various MEMS sensors under high vacuum by applying thermal Getter activation.

With its proven direct IR heating approach, ATV applies for the SRO-706 Getter system a top and bottom heating. The IR lamp arrays are independently monitored and controlled as 2 separate heating zones. This results that there is an excellent heating uniformity under vacuum when reaching a maximum temperature of 450°C during the Thermal getter process. The sensor or chip temperature remains below 100°C during the getter activation process. Optionally, a mass spectrometer can be added for residual gas analysis during the sealing process.

The SRO-706 Getter is a result of in-depth cooperation with our customer base and listing to the needs of the market as you may expect form ATV.

Key Features

• Programmable solder reflow oven
• Thermal reactor
• High vacuum package lid sealing system
• Thermal getter activation

The ATV SRO-716 series standalone IR vacuum reflow ovens are the benchmark for R&D, low volume pilot line and medium volume batch production. The system produces high quality results with outstanding process stability and repeatability. Configuration dependent, process capabilities include: flux-less soldering, eutectic die attach, gold tin soldering, void-free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.

Key Features

• Small Footprint, Freestanding Vacuum Reflow Oven
• Touch TCs with Quick Swap Hotplates
• Maximum Temperature 450°C, (optional 700°C)
• Temperature ramp-up rate 3.5K/sec
• Up to 100 process steps per profile recipe
• Automatic Chamber Opening / Closing
• Optional Top Heating
• Heated Area: 314 x 314 mm
• Oxygen < 1 ppm
• Optional High-Pressure Atmosphere: up to 3 bar (abs)
• Formic Acid, H2 or Solder Paste Activation

The Omega™ 4000 CO2 cleaning module provides powerful dry ice cleaning and surface preparation. The CO2 integrated spray is capable of quickly removing thin film, dust, and other surface contamination without damaging the part.

Uniquely designed, this compact cleaning unit comes in a stainless steel or powdercoated white frame. Test results have proven surfaces are prepared as good or better with the Omega™ 4000 than using etchants and dangerous solvents.

An optional, powerful combination of atmospheric plasma technology and integrated CO2 spray can be used to further break the bonds of tough organics. A final pass with CO2 spray removes the remaining debris, leaving a clean and high energy surface for bonding, coating, encapsulation, or under-fill processes.

The Omega™ 8000 CO₂ cleaning module is designed to operate 4 independent channels of CO₂ spray. By converting liquid CO₂ into solid CO₂ particles that are ejected out of the nozzle, it is possible to clean a wide variety of substrates. The CO₂ spray is combined with heated air propellant to form a non-condensing spray, leaving behind no residue after cleaning.

The Omega™ 8000 is configured with the SmartSpray™ process, which automatically adjusts the integrated spray, using pressure and temperature control, to maintain optimum user defined spray conditions. After being fully integrated, products don’t have to be removed, cleaned and returned to the production line, resulting in reduced human interaction, higher throughput and decreased cost-of-ownership.